Single compound, solvent-free adhesive cures at room temperature.
• Ideal for bonding dissimilar materials on a wide range of surfaces.
• Ideal for use with our Grow-Tek NFT Hydroponic Channels. joiners and end caps.
• Extremely durable bonds make TS-4000 ideal for applications where high stress, high flexibility, impact, thermal expansion and thermal shock loading are common.
• Gap fill: 0.010".
• Color: Clear.
• Temperature range: -65°F to 250°F.
• Cure speed (fixture/full): Less than 18 seconds/8 hours.
• Mil Spec A46050C. Type II, Class 3.
• 2 oz. bottle.